Chinese newspaper thepaper.cn quoted an unnamed source from Huawei's chip-designing arm HiSilicon as saying that he has not heard of the "Tashan Project” after an earlier report said Huawei has launched the project to make its foray into semiconductor manufacturing.
The colleagues around him are also not aware of this matter, the source added.
An IC industry source also said the rumor is not very credible, "a chip production line is easy to build? At least half of the equipment materials still need to be imported."
Huawei reportedly launches 'Tashan Project' to build 45nm chip production line this year
The "Tashan Project” was first mentioned by Weibo user @鹏鹏君驾到, who said Huawei is ready to build a chip production line without US technology with the project as Huawei was blocked by the US sanctions from getting OEM services from TSMC.
Huawei has begun to work with related companies, ready to build a y 45nm chip production line completely without US technology, which is expected to be completed within the year, the blogger said.
At the same time, Huawei is also exploring cooperation with other companies to build a 28-nm chip production line of its own technology, the blogger said.
There have been many voices talking about Huawei’s ambitions in chip-making recently.
At an event last week, Huawei Consumer Business CEO Richard Yu said Huawei will be rooted in all aspects in the semiconductor field to breakthrough basic research and precision manufacturing in physics and materials science.
Yu made the remarks while announcing Huawei will launch its next-generation flagship phone, the Mate40 series, with its Kirin chip in September.
He also said that Huawei's world-leading Kirin series of chips could not be manufactured after September 15 due to US sanctions.
