Semiconductor Manufacturing International Corporation (SMIC), China’s leading contract chipmaker, announced in a filing on Friday that it has entered into a framework agreement with the Beijing Development District Administrative Committee to jointly establish a joint venture in China to develop and operate an IC project.
The project, which will focus on the production of integrated circuits of 28nm and above, will be developed in two phases.
The first phase of the project aims to achieve a production capacity of approximately 100,000 pieces of 12" wafers per month.
The second phase of the project will be carried out in due course based on customer and market demand.
