According to Taiwan media reports, after announcing that the mass production of 3nm process is expected in the second half of 2022, TSMC will accelerate the pace of 2nm R&D and recently purchased two additional Extreme Ultraviolet (EUV) machines to invest in 2nm R&D.
The report said TSMC's capital expenditure this year will hardly be revised downward due to this and is still expected to rise to $16 billion.
TSMC is currently the most active foundry in introducing EUV devices to provide foundry mass production services, and due to TSMC's process sophistication in FinFET technology, TSMC has introduced all EUV devices at 5nm.
TSMC has announced the continuation of FinFET architecture at 3nm and the move to 2nm based on this technology architecture.
TSMC has previously disclosed in its 2019 Annual Report that it has begun development of 2nm technology and is conducting exploratory research on technologies below 2nm.
Founded in 1987, TSMC is the world's largest foundry semiconductor manufacturer, with customers including Apple and Qualcomm.
TSMC's shares are listed on the Taiwan Stock Exchange under the ticker symbol 2330, with additional American Depositary Receipts listed for trading on the New York Stock Exchange under the ticker symbol TSM.
At the close of trading on Friday, TSMC (NYSE:TSM) shares were up 1.69% to $55.2, totaling $7.5 billion. The market capitalization is approximately $286.271 billion.
