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Home › Tech › Huawei HiSilicon launches 2021 doctoral recruitment program in China
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Huawei HiSilicon launches 2021 doctoral recruitment program in China

October 1, 2020 By: Phate Zhang
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Despite the challenges, Huawei HiSilicon recently announced that it is continuing to recruit for the 2021 PhD graduates.

Recruiting is open to new PhD candidates who graduated between January 1, 2020 and December 31, 2021 from universities at home and abroad, and will be based in major Chinese cities including Beijing, Shanghai, Shenzhen, Dongguan, Wuhan, Xi'an, Chengdu, Hangzhou, Nanjing, and Suzhou.

In the job postings, the chip category includes chip architecture engineer, processor development engineer, computing theory and model research institute, ASIC design engineer, and advanced semiconductor process development engineer.

Research jobs include storage algorithm engineers, security engineers, AI algorithm engineers, and more.

System jobs include network technology research engineer, system engineer.

Hardware jobs include RF system engineer, hardware technology engineer.

Software jobs include chip software architecture engineer.

Huawei reportedly chartered a plane to bring back all the Kirin chips

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