The memory chip packaging and testing project, in which Konka Group invested 2 billion yuan, has been built to the third floor, the main body will be completed in June. It is expected to be put into production by the end of the year.
Yancheng High-Tech Zone project leader said that after the project is completed and put into production, it can achieve annual sales of 4 billion yuan, sealing and testing capacity of 20KK/month and production yield of more than 99.95%.
Konka storage chip packaging test project, invested by Konka Group, with a total investment of 2 billion yuan, mainly engaged in the packaging test and sales of storage chips, after the completion of all the annual sales of 4 billion yuan, tax revenue of 100 million yuan.
When the project broke ground on March 18, Konka's president, Zhou Bin, said that when completed, the project would be the only unmanned factory in the country open to third parties and would serve as a benchmark for Yancheng City to build a high-tech cluster for semiconductors.
On November 25, 2019, Konka had issued an announcement that, due to business development needs, Konka intends to invest in the construction of a storage chip packaging test plant with the Company's controlling subsidiary, Konka Semiconductor Technology (Shenzhen) Co.
The main operating body of the storage chip packaging and testing project is Konka Core, located in Yancheng City Intelligent Terminal Industrial Park, with a total investment of 1.082 billion yuan.
The total investment is 1.082 billion yuan, in which about 500 million yuan will be invested in the purchase of equipment, investment in the construction of storage chip packaging test plant, packaging test and sales of storage chips, the end of 2020 is planned for trial production.
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