The GK2302V200 series of Goke Microelectronics' new generation solid state drive controllers are equipped with the third generation NANDXtra engine and are fully adaptable to 128 layers of TLC and QLC chip for efficient and secure data storage experience.
Goke Microelectronics' new solid-state drive controller GK2302V200 Series Introduced, Fully Adapted to 128-Layer Chip Including Yangtze Memory
Goke Microelectronics continues to push the boundaries of iterative SSD controller upgrades with the GK2302V200 series, which supports a variety of 2D MLC/TLC, 3D MLC/TLC/QLC flash chips and is compatible with Yangtze Memory's latest 128-layer 3D TLC/QLC chips.
The Goke Microelectronics GK2302V200 is equipped with a domestic embedded CPU IP core, demonstrating the concept of "China Design"; it supports SATA 3.2 standard interface and maximum reading bandwidth of 550MB/s.
Goke Microelectronics' third generation NANDXtra reliability engine, enhanced LDPC engine and Multi Group RAID protection to enhance NAND chip life; 2-channel flash memory interface, support Toggle 2.0 & ONFI 4.0 interface protocol, interface bandwidth 533MT/s; maximum 2TB capacity.
GK2302V200 supports national SM2, SM3, SM4 algorithms and RSA2048/SHA-256/AES-256 to provide comprehensive security of data encryption.
It has passed the National Secret Level 1 certification and National Information Security EAL-3 certification, ensuring reliability, stability and performance.
