ChangXin Memory Technologies' 19nm wafer chip capacity will increase from 20,000 wafers/month to 40,000 wafers/month by the end of the quarter, Mydrivers.com said, citing industry updates.
Not only that, but ChangXin's 17nm process chip is on track to be mass-produced by the end of the year, the report said.
ChangXin officially mass-produced its 10nm (10nm~19nm) DDR4 memory chips (8Gb) in September last year.
ChangXin currently has a 12-inch wafer fab with a total capacity of 120,000 wafers/month.
This week, ChangXin reached an agreement with Rambus to license the latter's DRAM technology.
Earlier, ChangXin acquired more than 10 million technical documents and 2.8TB of data related to DRAM from Qimonda through an agreement with Polaris Innovations, a wholly owned subsidiary of WiLAN.
ChangXin was launched in May 2016 in Hefei, Anhui Province, with a total investment of 150 billion yuan, specializing in the development, production and sales of DRAM memory.
