Yangtze Memory Technologies (YMTC), a subsidiary owned by Tsinghua Unigroup, said that after three years of construction, its 64-layer three-dimensional flash memory product developed independently has achieved mass production.
According to the Chutian Metropolis Daily, the company's deputy chairman Yang Daohong said that their current task is to reach a monthly production capacity of 100,000 as scheduled, and in the second phase of the project, it will reach a monthly production capacity of 300,000 pieces.
YMTC released its breakthrough technology, Xtacking, as early as 2018. The technology will significantly increase NAND I/O speed to 3.0Gbps.
Xtacking can independently process peripheral circuits responsible for data I/O and memory unit operations on a wafer. Such a processing method is advantageous for selecting an appropriate advanced logic process, so that NAND can obtain higher I/O interface speed and more operation functions.
The memory cells will also be processed independently on another wafer. When the two wafers are completed separately, the innovative Xtacking technology can connect the two to the circuit through millions of metal VIA (Vertical Interconnect Accesses) in a single processing step, with only a limited increase of the cost.
Now, YMTC has successfully applied Xtacking technology to the development of its second-generation 3D NAND products. After mass production, it is expected that more storage products will use domestic chips.
Yang Daohong also revealed that not only the 64-layer 3D flash memory products have been mass-produced, but also the development of higher-level 3D flash memory products has achieved staged results, further narrowing the gap with leading international companies.
YMTC was registered and established in Wuhan Donghu New Technology Development Zone on July 26, 2016. The company's business scope includes technology development in the field of semiconductor integrated circuit technology; design of integrated circuits and related products.
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