MediaTek announced a new processor product on its website, the Helio G70, a chip for 4G mobile phones.
Helio G70 uses 8-core 64-bit design, 4 A75 large cores clocked at 2GHz + 4 A55 small cores clocked at 1.7GHz, memory supports LPDDR4x, up to 8GB / 1800MHz, and storage supports up to eMMC5.1.
Helio G70 is equipped with Arm Mali-G52 2EEMC2, GPU frequency is 820MHz, and supports a maximum resolution of 2520x1080.
Helio G70 supports up to 48-megapixel cameras, or dual 16-megapixel cameras.
In addition Helio G70 is a 4G chip that supports Beidou, Galileo, Glonass and GPS positioning. It also supports Wi-Fi 5, and supports Bluetooth 5.0.
The parameters of the Helio G70 are not high. Positioning a mobile phone that should cost around 1,000 yuan may form a positive competition with the Snapdragon 710. It is reported that Helio G70 may start with Redmi 9.
