Semiconductor Manufacturing International Corporation (SMIC), China's leading contract chipmaker, has invested RMB 49.7 billion ($7.7 billion) in a fab in Beijing, with the first phase of the project scheduled for completion in 2024.
SMIC, together with China Integrated Circuit Investment Industry Fund and Beijing E-Town International Investment & Development Co Ltd, established SMIC Jingcheng Integrated Circuit Manufacturing on December 7, 2020, which was announced by the Beijing Yizhuang Developer Government on February 23.
SMIC Jingcheng's Phase I project is currently under construction and is expected to cost approximately RMB 7.6 billion and will have a capacity of approximately 100,000 12-inch wafers per month upon completion.
(SMIC's fab phase I project site in Beijing)
The area of the SMIC Jingcheng Phase I project is approximately 240,000 square meters, including the FAB3P1 production plant and supporting buildings and structures.
SMIC has multiple 8-inch and 12-inch production sites in Shanghai, Beijing, Tianjin, and Shenzhen, China, with a combined capacity of 450,000 wafers per month (on an 8-inch basis) as of the end of 2019.
SMIC's market share in 2019 is approximately 5%, ranking 5th globally, with a 16% market share in China.
SMIC says it will be cautious in expanding advanced process capacity in 2021
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