Foxconn's planned advanced chip packaging and testing plant in Qingdao has recently broken ground, DigiTimes quoted a source as saying.
The factory plans to invest 60 billion yuan ($8.5 billion), dedicated to providing advanced packaging and testing technology for chips used in 5G and artificial intelligence-related devices, the report said.
The report also said that after the completion of this project, the designed monthly capacity is 30,000 12-inch wafers.
However, according to a later report on thepaper.cn, Foxconn said the amount mentioned in the above report is inaccurate, and specific information needs to be based on official information.
Notably, this afternoon, DigiTimes also corrected the amount of Foxconn's investment in the factory, and the corrected report showed that the factory's investment amounted to 1.5 billion yuan.
On April 15 this year, Qingdao signed a contract with Foxconn, and Foxconn's high-end packaging and the testing project is set to be established there.
The project is scheduled to start construction this year, start production in 2021. For the specific investment amount of the project, Foxconn did not announce.
The plant will package chips for 5G communications, artificial intelligence, and other applications that are currently experiencing rapid growth in demand.